Semiconductor memory device and information processing system including the same

ABSTRACT

The semiconductor memory device includes plural core chips that are allocated with different chip identification information from each other and an interface chip that controls the plural core chips. The interface chip receives address information to specify memory cells and commonly supplies a part of the address information as chip selection information for comparison with the chip identification information to the plural core chips. As a result, since the controller recognizes that an address space is simply enlarged, the same interface as that in the semiconductor memory device according to the related art can be used.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor memory device and aninformation processing system including the same. More particularly, thepresent invention relates to a semiconductor memory device that includesplural core chips and an interface chip to control the cores and aninformation processing system including the same.

2. Description of the Related Art

A memory capacity that is required in a semiconductor memory device suchas a dynamic random access memory (DRAM) has increased every year. Inrecent years, a memory device that is called a multi-chip package whereplural memory chips are laminated is suggested to satisfy the requiredmemory capacity. However, since the memory chip used in the multi-chippackage is a common memory chip capable of operating even though thememory chip is a single chip, a so-called front end unit that performs afunction of an interface with an external device (for example, memorycontroller) is included in each memory chip. For this reason, an areafor a memory core in each memory chip is restricted to an area obtainedby subtracting the area for the front end unit from a total chip area,and it is difficult to greatly increase a memory capacity for each chip(for each memory chip).

In addition, a circuit that constitutes the front end unit ismanufactured at the same time as a back end unit including a memorycore, regardless of the circuit being a circuit of a logic system.Therefore there have been a further problem that it is difficult tospeed up the front end unit.

As a method to resolve the above problem, a method that integrates thefront end unit and the back end unit in individual chips and laminatesthese chips, thereby constituting one semiconductor memory device, issuggested (for example, Japanese Patent Application Laid-Open (JP-A) No.2007-157266). According to this method, with respect to plural corechips each of which is integrated with the back end unit without thefront end unit, it becomes possible to increase a memory capacity foreach chip (for each core chip) because an occupied area assignable forthe memory core increases. Meanwhile, with respect to an interface chipthat is integrated with the front end unit and is common to the pluralcore chips, it becomes possible to form its circuit with a high-speedtransistor because the interface chip can be manufactured using aprocess different from that of the memory core. In addition, since theplural core chips can be allocated to one interface chip, it becomespossible to provide a semiconductor memory device that has a largememory capacity and a high operation speed as a whole.

However, this kind of semiconductor memory device is recognized as onlyone memory chip, in view of a controller. For this reason, when theplural core chips are allocated to one interface chip, how to perform anindividual access to each core chip becomes a problem. In the case ofthe general multi-chip package, each memory chip is individuallyselected using a dedicated chip selection terminal (/CS) in each memorychip. Meanwhile, in the semiconductor memory device described above,since the chip selection terminal is provided in only the interfacechip, each core chip cannot be individually selected by a chip selectionsignal.

In order to resolve this problem, JP-A No. 2007-157266 described above,a chip identification number is allocated to each core chip, a chipselection address is commonly provided from the interface chip to eachcore chip, and individual selection of each core chip is realized.

However, since the chip selection address that is described in JP-A No.2007-157266 is not used in the common semiconductor memory device,compatibility with the semiconductor memory device according to therelated art may be lost.

For this reason, an interface that is different from the interface usedin the semiconductor memory device according to the related art isrequired in the controller to control the semiconductor memory device,and versatility is low. Accordingly, the semiconductor memory devicethat includes the plural core chips and the interface chip is alsorequired to secure compatibility with the semiconductor memory deviceaccording to the related art to have the versatility.

SUMMARY

In one embodiment, there is provided a semiconductor device comprising:a plurality of core chips that include a memory cell array having aplurality of memory cells, respectively, and assigned different chipidentification information from each other; and an interface chip thatcontrols the plurality of core chips by using chip selection informationthat is compared with the chip identification information, wherein theinterface chip receives address information from outside to specify atleast one of the memory cells included in the memory cell array andcommonly supplies a part of the address information as the chipselection information to the plurality of core chips.

According to the present invention, since a part of the addressinformation is used as the chip identification information, differentsignal from that of the semiconductor memory device according to therelated art is not needed. Therefore, since the controller recognizesthat an address space is simply enlarged, the same interfaces as that inthe semiconductor memory device according to the related art can beused.

BRIEF DESCRIPTION OF THE DRAWINGS

The above features and advantages of the present invention will be moreapparent from the following description of certain preferred embodimentstaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic cross-sectional view illustrating the structure ofa semiconductor memory device according to the preferred embodiment ofthe present invention;

FIGS. 2A to 2C are diagram showing the various types of TSV provided ina core chip;

FIG. 3 is a cross-sectional view illustrating the structure of the TSVof the type shown in FIG. 2A;

FIG. 4 is a block diagram illustrating the circuit configuration of thesemiconductor memory device;

FIG. 5 is a diagram showing a circuit associated with selection of thecore chips;

FIG. 6 is a table illustrating allocation of an address according to theI/O configuration;

FIG. 7 is another example of a circuit associated with selection of thecore chips, which specifically shows the configuration of the layeraddress comparing circuit;

FIG. 8 is a circuit diagram of the layer address comparing circuit;

FIG. 9 is a block diagram showing the circuit configuration of thecontrol logic circuit;

FIG. 10 is a timing chart illustrating an operation of the control logiccircuit;

FIGS. 11A and 11B are tables illustrating allocation of an addressaccording to the I/O configuration, when the defective chip exists; and

FIG. 12 is a diagram showing the configuration of a data processingsystem using the semiconductor memory device according to thisembodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Preferred embodiments of the present invention will be explained belowin detail with reference to the accompanying drawings.

FIG. 1 is a schematic cross-sectional view provided to explain thestructure of a semiconductor memory device 10 according to the preferredembodiment of the present invention.

As shown in FIG. 1, the semiconductor memory device 10 according to thisembodiment has the structure where 8 core chips CC0 to CC7 that have thesame function and structure and are manufactured using the samemanufacture mask, an interface chip IF that is manufactured using amanufacture mask different from that of the core chips and an interposerIP are laminated. The core chips CC0 to CC7 and the interface chip IFare semiconductor chips using a silicon substrate and are electricallyconnected to adjacent chips in a vertical direction through pluralThrough Silicon Vias (TSV) penetrating the silicon substrate. Meanwhile,the interposer IP is a circuit board that is made of a resin, and pluralexternal terminals (solder balls) SB are formed in a back surface IPb ofthe interposer IP.

Each of the core chips CC0 to CC7 is a semiconductor chip which consistsof circuit blocks other than a so-called front end unit (front endfunction) performing a function of an interface with an external devicethrough an external terminal among circuit blocks included in a 1 GbDDR3 (Double Data Rate 3)-type SDRAM (Synchronous Dynamic Random AccessMemory). The SDRAM is a well-known and common memory chip that includesthe front end unit and a so-called back end unit having a plural memorycells and accessing the memory cells. The SDRAM operates even as asingle chip and is capable to communicate directly with a memorycontroller. That is, each of the core chips CC0 to CC7 is asemiconductor chip where only the circuit blocks belonging to the backend unit are integrated in principle. As the circuit blocks that areincluded in the front end unit, a parallel-serial converting circuit(data latch circuit) that performs parallel/serial conversion oninput/output data between a memory cell array and a data input/outputterminal and a DLL (Delay Locked Loop) circuit that controlsinput/output timing of data are exemplified, which will be described indetail below. The interface chip IF is a semiconductor chip in whichonly the front end unit is integrated. Accordingly, an operationfrequency of the interface chip is higher than an operation frequency ofthe core chip. Since the circuits that belong to the front end unit arenot included in the core chips CC0 to CC7, the core chips CC0 to CC7cannot be operated as the single chips, except for when the core chipsare operated in a wafer state for a test operation in the course ofmanufacturing the core chips. The interface chip IF is needed to operatethe core chips CC0 to CC7. Accordingly, the memory integration of thecore chips is denser than the memory integration of a general singlechip. In the semiconductor memory device 10 according to thisembodiment, the interface chip has a front end function forcommunicating with the external device at a first operation frequency,and the plural core chips have a back end function for communicatingwith only the interface chip at a second operation frequency lower thanthe first operation frequency. Accordingly, each of the plural corechips includes a memory cell array that stores plural information, and abit number of plural read data for each I/O (DQ) that are supplied fromthe plural core chips to the interface chip in parallel is plural andassociated with a one-time read command provided from the interface chipto the core chips. In this case, the plural bit number corresponds to aprefetch data number to be well-known.

The interface chip IF functions as a common front end unit for the eightcore chips CC0 to CC7. Accordingly, all external accesses are performedthrough the interface chip IF and inputs/outputs of data are alsoperformed through the interface chip IF. In this embodiment, theinterface chip IF is disposed between the interposer IP and the corechips CC0 to CC7. However, the position of the interface chip IF is notrestricted in particular, and the interface chip IF may be disposed onthe core chips CC0 to CC7 and may be disposed on the back surface IPb ofthe interposer IP. When the interface chip IF is disposed on the corechips CC0 to CC7 in a face-down manner or is disposed on the backsurface IPb of the interposer IP in a face-up manner, the TSV does notneed to be provided in the interface chip IF. The interface chip IF maybe disposed to be interposed between the two interposers IP.

The interposer IP functions as a rewiring substrate to increase anelectrode pitch and secures mechanical strength of the semiconductormemory device 10. That is, an electrode 91 that is formed on a topsurface IPa of the interposer IP is drawn to the back surface IPb via athrough-hole electrode 92 and the pitch of the external terminals SB isenlarged by the rewiring layer 93 provided on the back surface IPb. InFIG. 1, only the two external terminals SB are shown. In actuality,however, three or more external terminals are provided. The layout ofthe external terminals SB is the same as that of the DDR3-type SDRAMthat is determined by the regulation. Accordingly, the semiconductormemory device can be treated as one DDR3-type SDRAM from the externalcontroller.

As shown in FIG. 1, a top surface of the uppermost core chip CC0 iscovered by an NCF (Non-Conductive Film) 94 and a read frame 95. Gapsbetween the core chips CC0 to CC7 and the interface chip IF are filledwith an underfill 96 and surrounding portions of the gaps are covered bya sealing resin 97. Thereby, the individual chips are physicallyprotected.

When most of the TSVs provided in the core chips CC0 to CC7 aretwo-dimensionally viewed from a lamination direction, that is, viewedfrom an arrow shown in FIG. 1, the TSVs are short-circuited from theTSVs of other layers provided at the same position. That is, as shown inFIG. 2A, the vertically disposed TSV1s that are provided at the sameposition in plain view are short-circuited, and one wiring line isconfigured by the TSV1. The TSV1 that are provided in the core chips CC0to CC7 are connected to internal circuits 4 in the core chips,respectively. Accordingly, input signals (command signal, addresssignal, etc.) that are supplied from the interface chip IF to the TSV1sshown in FIG. 2A are commonly input to the internal circuits 4 of thecore chips CC0 to CC7. Output signals (data etc.) that are supplied fromthe core chips CC0 to CC7 to the TSV1 are wired-ORed and input to theinterface chip IF.

Meanwhile, as shown in FIG. 2B, the a part of TSVs are not directlyconnected to the TSV2 of other layers provided at the same position inplain view but are connected to the TSV2 of other layers through theinternal circuits 5 provided in the core chips CC0 to CC7. That is, theinternal circuits 5 that are provided in the core chips CC0 to CC7 arecascade-connected through the TSV2. This kind of TSV2 is used tosequentially transmit predetermined information to the internal circuits5 provided in the core chips CC0 to CC7. As this information, layeraddress information to be described below is exemplified.

Another TSV group is short-circuited from the TSVs of other layerprovided at the different position in plan view, as shown in FIG. 2C.With respect to this kind of TSV group 3, internal circuits 6 of thecore chips CC0 to CC7 are connected to the TSV3 a provided at thepredetermined position P in plain view. Thereby, information can beselectively input to the internal circuits 6 provided in the core chips.As this information, defective chip information to be described below isexemplified.

As such, as types of the TSVs provided in the core chips CC0 to CC7,three types (TSV1 to TSV3) shown in FIGS. 2A to 2C exist. As describedabove, most of the TSVs are of a type shown in FIG. 2A, and an addresssignal, a command signal, and a clock signal are supplied from theinterface chip IF to the core chips CC0 to CC7, through the TSV1 of thetype shown in FIG. 2A. Read data and write data are input to and outputfrom the interface chip IF through the TSV1 of the type shown in FIG.2A. Meanwhile, the TSV2 and TSV3 of the types shown in FIGS. 2B and 2Care used to provide individual information to the core chips CC0 to CC7having the same structure.

FIG. 3 is a cross-sectional view illustrating the structure of the TSV1of the type shown in FIG. 2A.

As shown in FIG. 3, the TSV1 is provided to penetrate a siliconsubstrate 80 and an interlayer insulating film 81 provided on a surfaceof the silicon substrate 80. Around the TSV1, an insulating ring 82 isprovided. Thereby, the TSV1 and a transistor region are insulated fromeach other. In an example shown in FIG. 3, the insulating ring 82 isprovided double. Thereby, capacitance between the TSV1 and the siliconsubstrate 80 is reduced.

An end 83 of the TSV1 at the back surface of the silicon substrate 80 iscovered by a back surface bump 84. The back surface bump 84 is anelectrode that contacts a surface bump 85 provided in a core chip of alower layer. The surface bump 85 is connected to an end 86 of the TSV1,through plural pads P0 to P3 provided in wiring layers L0 to L3 andplural through-hole electrodes TH1 to TH3 connecting the pads to eachother. Thereby, the surface bump 85 and the back surface bump 84 thatare provided at the same position in plain view are short-circuited.Connection with internal circuits (not shown in the drawings) isperformed through internal wiring lines (not shown in the drawings)drawn from the pads P0 to P3 provided in the wiring layers L0 to L3.

FIG. 4 is a block diagram illustrating the circuit configuration of thesemiconductor memory device 10.

As shown in FIG. 4, the external terminals that are provided in theinterposer IP include clock terminals 11 a and 11 b, an clock enableterminal 11 c, command terminals 12 a to 12 e, an address terminal 13, adata input/output terminal 14, data strobe terminals 15 a and 15 b, acalibration terminal 16, and power supply terminals 17 a and 17 b. Allof the external terminals are connected to the interface chip IF and arenot directly connected to the core chips CC0 to CC7, except for thepower supply terminals 17 a and 17 b.

First, a connection relationship between the external terminals and theinterface chip IF performing the front end function and the circuitconfiguration of the interface chip IF will be described.

The clock terminals 11 a and 11 b are supplied with external clocksignals CK and /CK, respectively, and the clock enable terminal 11 c issupplied with a clock enable signal CKE. The external clock signals CKand /CK and the clock enable signal CKE are supplied to a clockgenerating circuit 21 provided in the interface chip IF. A signal where“/” is added to a head of a signal name in this specification indicatesan inversion signal of a corresponding signal or a low-active signal.Accordingly, the external clock signals CK and /CK are complementarysignals. The clock generating circuit 21 generates an internal clocksignal ICLK, and the generated internal clock signal ICLK is supplied tovarious circuit blocks in the interface chip IF and is commonly suppliedto the core chips CC0 to CC7 through the TSVs.

A DLL circuit 22 is included in the interface chip IF and aninput/output clock signal LCLK is generated by the DLL circuit 22. Theinput/output clock signal LCLK is supplied to an input/output buffercircuit 23 included in the interface chip IF. A DLL function is used tocontrol the front end unit by using the signal LCLK synchronized with asignal of the external device, when the semiconductor memory device 10communicates with the external device. Accordingly, DLL function is notneeded for the core chips CC0 to CC7 as the back end.

The command terminals 12 a to 12 e are supplied with a row-addressstrobe signal /RAS, a column address strobe signal /CAS, a write enablesignal /WE, a chip select signal /CS, and an on-die termination signalODT. These command signals are supplied to a command input buffer 31that is provided in the interface chip IF. The command signals suppliedto the command input buffer 31 are further supplied to a command decoder32. The command decoder 32 is a circuit that holds, decodes, and countsthe command signals in synchronization with the internal clock ICLK andgenerates various internal commands ICMD. The generated internal commandICMD is supplied to the various circuit blocks in the interface chip IFand is commonly supplied to the core chips CC0 to CC7 through the TSVs.

The address terminal 13 is a terminal to which address signals A0 to A15and BA0 to BA2 are supplied, and the supplied address signals A0 to A15and BA0 to BA2 are supplied to an address input buffer 41 provided inthe interface chip IF. An output of the address input buffer 41 iscommonly supplied to the core chips CC0 to CC7 through the TSVs. Theaddress signals A0 to A15 are supplied to a mode register 42 provided inthe interface chip IF, when the semiconductor memory device 10 enters amode register set. The address signals BA0 to BA2 (bank addresses) aredecoded by an address decoder (not shown in the drawings) provided inthe interface chip IF, and a bank selection signal B that is obtained bythe decoding is supplied to a data latch circuit 25. This is becausebank selection of the write data is performed in the interface chip IF.

The data input/output terminal 14 is used to input/output read data orwrite data DQ0 to DQ15. The data strobe terminals 15 a and 15 b areterminals that are used to input/output strobe signals DQS and /DQS. Thedata input/output terminal 14 and the data strobe terminals 15 a and 15b are connected to the input/output buffer circuit 23 provided in theinterface chip IF. The input/output buffer circuit 23 includes an inputbuffer IB and an output buffer OB, and inputs/outputs the read data orthe write data DQ0 to DQ15 and the strobe signals DQS and /DQS insynchronization with the input/output clock signal LCLK supplied fromthe DLL circuit 22. If an internal on-die termination signal IODT issupplied from the command decoder 32, the input/output buffer circuit 23causes the output buffer OB to function as a termination resistor. Animpedance code DRZQ is supplied from the calibration circuit 24 to theinput/output buffer circuit 23. Thereby, impedance of the output bufferOB is designated. The input/output buffer circuit 23 includes awell-known FIFO circuit.

The calibration circuit 24 includes a replica buffer RB that has thesame circuit configuration as the output buffer OB. If the calibrationsignal ZQ is supplied from the command decoder 32, the calibrationcircuit 24 refers to a resistance value of an external resistor (notshown in the drawings) connected to the calibration terminal 16 andperforms a calibration operation. The calibration operation is anoperation for matching the impedance of the replica buffer RB with theresistance value of the external resistor, and the obtained impedancecode DRZQ is supplied to the input/output buffer circuit 23. Thereby,the impedance of the output buffer OB is adjusted to a desired value.

The input/output buffer circuit 23 is connected to a data latch circuit25. The data latch circuit 25 includes a FIFO circuit (not shown in thedrawings) that realizes a FIFO function which operates by latencycontrol realizing the well-known DDR function and a multiplexer MUX (notshown in the drawings). The input/output buffer circuit 23 convertsparallel read data, which is supplied from the core chips CC0 to CC7,into serial read data, and converts serial write data, which is suppliedfrom the input/output buffer, into parallel write data. Accordingly, thedata latch circuit 25 and the input/output buffer circuit 23 areconnected in serial and the data latch circuit 25 and the core chips CC0to CC7 are connected in parallel. In this embodiment, each of the corechips CC0 to CC7 is the back end unit of the DDR3-type SDRAM and aprefetch number is 0.8 bits. The data latch circuit 25 and each banks ofthe core chips CC0 to CC7 are connected respectively, and the number ofbanks that are included in each of the core chips CC0 to CC7 is 8.Accordingly, connection of the data latch circuit 25 and the core chipsCC0 to CC7 becomes 64 bits (8 bits×8 banks) for each DQ.

Parallel data, not converted into serial data, is basically transferredbetween the data latch circuit 25 and the core chips CC0 to CC7. Thatis, in a common SDRAM (in the SDRAM, a front end unit and a back endunit are constructed in one chip), between the outside of the chip andthe SDRAM, data is input/output in serial (that is, the number of datainput/output terminals is one for each DQ). However, in the core chipsCC0 to CC7, an input/output of data between the interface chip IF andthe core chips is performed in parallel. This point is the importantdifference between the common SDRAM and the core chips CC0 to CC7.However, all of the prefetched parallel data do not need to beinput/output using the different TSVs, and partial parallel/serialconversion may be performed in the core chips CC0 to CC7 and the numberof TSVs that are needed for each DQ may be reduced. For example, all ofdata of 64 bits for each DQ do not need to be input/output using thedifferent TSVs, and 2-bit parallel/serial conversion may be performed inthe core chips CC0 to CC7 and the number of TSVs that are needed foreach DQ may be reduced to ½ (32).

To the data latch circuit 25, a function for enabling a test in aninterface chip unit is added. The interface chip does not have the backend unit. For this reason, the interface chip cannot be operated as asingle chip in principle. However, if the interface chip never operatesas the single chip, an operation test of the interface chip in a waferstate may not be performed. This means that the semiconductor memorydevice 10 cannot be tested in case an assembly process of the interfacechip and the plural core chips is not executed, and the interface chipis tested by testing the semiconductor memory device 10. In this case,when a defect that cannot be recovered exists in the interface chip, theentire semiconductor memory device 10 is not available. In considerationof this point, in this embodiment, a portion of a pseudo back end unitfor a test is provided in the data latch circuit 25, and a simple memoryfunction is enabled at the time of a test.

The power supply terminals 17 a and 17 b are terminals to which powersupply potentials VDD and VSS are supplied, respectively. The powersupply terminals 17 a and 17 b are connected to a power-on detectingcircuit 43 provided in the interface chip IF and are also connected tothe core chips CC0 to CC7 through the TSVs. The power-on detectingcircuit 43 detects the supply of power. On detecting the supply ofpower, the power-on detecting circuit 43 activates a layer addresscontrol circuit 45 on the interface chip IF.

The layer address control circuit 45 changes a layer address due to theI/O configuration of the semiconductor device 10 according to thepresent embodiment. As described above, the semiconductor memory device10 includes 16 data input/output terminals 14. Thereby, a maximum I/Onumber can be set to 16 bits (DQ0 to DQ15). However, the I/O number isnot fixed to 16 bits and may be set to 8 bits (DQ0 to DQ7) or 4 bits(DQ0 to DQ3). The address allocation is changed according to the I/Onumber and the layer address is also changed. The layer address controlcircuit 45 changes the address allocation according to the I/O numberand is commonly connected to the core chips CC0 to CC7 through the TSVs.

The interface chip IF is also provided with a layer address settingcircuit 44. The layer address setting circuit 44 is connected to thecore chips CC0 to CC7 through the TSVs. The layer address settingcircuit 44 is cascade-connected to the layer address generating circuit46 of the core chips CC0 to CC7 using the TSV2 of the type shown in FIG.2B, and reads out the layer addresses set to the core chips CC0 to CC7at testing.

The interface chip IF is also provided with a defective chip informationholding circuit 33. When a defective core chip that does not normallyoperates is discovered after an assembly, the defective chip informationholding circuit 33 holds its chip number. The defective chip informationholding circuit 33 is connected to the core chips CC0 to CC7 through theTSVs. The defective chip information holding circuit is connected to thecore chips CC0 to CC7 while being shifted, using the TSV3 of the typeshown in FIG. 2C.

The above description is the outline of the connection relationshipbetween the external terminals and the interface chip IF and the circuitconfiguration of the interface chip IF. Next, the circuit configurationof the core chips CC0 to CC7 will be described.

As shown in FIG. 4, memory cell arrays 50 that are included in the corechips CC0 to CC7 performing the back end function are divided into eightbanks. A bank is a unit that can individually receive a command. Thatis, the individual banks can be independently and nonexclusivelycontrolled. From the outside of the semiconductor memory device 10, eachback can be independently accessed. For example, a part of the memorycell array 50 belonging to the bank 1 and another part of the memorycell array 50 belonging to the bank 2 are controlled nonexclusively.That is, word lines WL and bit lines BL corresponding to each banksrespectively are independently accessed at same period by differentcommands one another. For example, while the bank 1 is maintained to beactive (the word lines and the bit lines are controlled to be active),the bank 2 can be controlled to be active. However, the externalterminals (for example, plural control terminals and plural I/Oterminals) of the semiconductor memory device 10 are shared. In thememory cell array 50, the plural word lines WL and the plural bit linesBL intersect each other, and memory cells MC are disposed atintersections thereof (in FIG. 4, only one word line WL, one bit lineBL, and one memory cell MC are shown). The word line WL is selected by arow decoder 51. The bit line BL is connected to a corresponding senseamplifier SA in a sense circuit 53. The sense amplifier SA is selectedby a column decoder 52.

The row decoder 51 is controlled by a row address supplied from a rowcontrol circuit 61. The row control circuit 61 includes an addressbuffer 61 a that receives a row address supplied from the interface chipIF through the TSV, and the row address that is buffered by the addressbuffer 61 a is supplied to the row decoder 51. The address signal thatis supplied through the TSV is supplied to the row control circuit 61through the input buffer B1. The row control circuit 61 also includes arefresh counter 61 b. When a refresh signal is issued by a control logiccircuit 63, a row address that is indicated by the refresh counter 61 bis supplied to the row decoder 51.

The column decoder 52 is controlled by a column address supplied from acolumn control circuit 62. The column control circuit 62 includes anaddress buffer 62 a that receives the column address supplied from theinterface chip IF through the TSV, and the column address that isbuffered by the address buffer 62 a is supplied to the column decoder52. The column control circuit 62 also includes a burst counter 62 bthat counts the burst length.

The sense amplifier SA selected by the column decoder 52 is connected tothe data control circuit 54 through some amplifiers (sub-amplifiers ordata amplifiers or the like) which are not shown in the drawings.Thereby, read data of 8 bits (=prefetch number) for each I/O (DQ) isoutput from the data control circuit 54 at reading, and write data of 8bits is input to the data control circuit 54 at writing. The datacontrol circuit 54 and the interface chip IF are connected in parallelthrough the TSV.

The control logic circuit 63 receives an internal command ICMD suppliedfrom the interface chip IF through the TSV and controls the row controlcircuit 61 and the column control circuit 62, based on the internalcommand ICMD. The control logic circuit is connected to a layer addresscomparing circuit (chip information comparing circuit) 47. The layeraddress comparing circuit 47 detects whether the corresponding core chipis target of access, and the detection is performed by comparing a SEL(chip selection information) which is a part of the address signalsupplied from the interface chip IF through the TSV and a layer addressLID (chip identification information) set to the layer addressgenerating circuit 46.

In the layer address generating circuit 46, unique layer addresses areset to the core chips CC0 to CC7, respectively, at initialization. Amethod of setting the layer addresses is as follows. First, after thesemiconductor memory device 10 is initialized, a minimum value (0, 0, 0)as an initial value is set to the layer address generating circuits ofthe core chips CC0 to CC7. The layer address generating circuits 46 ofthe core chips CC0 to CC7 are cascade-connected using the TSVs of thetype shown in FIG. 2B, and have increment circuits provided therein. Thelayer address (0, 0, 0) that is set to the layer address generatingcircuit 46 of the core chip CC0 of the uppermost layer is transmitted tothe layer address generating circuit 46 of the second core chip CC1through the TSV and is incremented. As a result, a different layeraddress (0, 0, 1) is generated. Hereinafter, in the same way as theabove case, the generated layer addresses are transmitted to the corechips of the lower layers and the layer address generating circuits 46in the core chips increment the transmitted layer addresses. A maximumvalue (1, 1, 1) as a layer address is set to the layer addressgenerating circuit 46 of the core chip CC7 of the lowermost layer.Thereby, the unique layer addresses are set to the core chips CC0 toCC7, respectively.

The layer address generating circuit 46 is provided with a defectivechip signal DEF supplied from the defective chip information holdingcircuit 33 of the interface chip IF, through the TSV. As the defectivechip signal DEF is supplied to the individual core chips CC0 to CC7using the TSV3 of the type shown in FIG. 2C, the defective chip signalsDEF can be supplied to the core chips CC0 to CC7, individually. Thedefective chip signal DEF is activated when the corresponding core chipis a defective chip. When the defective chip signal DEF is activated,the layer address generating circuit 46 transmits, to the core chip ofthe lower layer, a non-incremented layer address, not an incrementedlayer address. The defective chip signal DEF is also supplied to thecontrol logic circuit 63. When the defective chip signal DEF isactivated, the control logic circuit 63 is completely halted. Thereby,the defective core chip performs neither read operation nor writeoperation, even though an address signal or a command signal is inputfrom the interface chip IF.

An output of the control logic circuit 63 is also supplied to a moderegister 64. When an output of the control logic circuit 63 shows a moderegister set, the mode register 64 is updated by an address signal.Thereby, operation modes of the core chips CC0 to CC7 are set.

Each of the core chips CC0 to CC7 has an internal voltage generatingcircuit 70. The internal voltage generating circuit 70 is provided withpower supply potentials VDD and VSS. The internal voltage generatingcircuit 70 receives these power supply potentials and generates variousinternal voltages. As the internal voltages that are generated by theinternal voltage generating circuit 70, an internal voltage VPERI (≈VDD)for operation power of various peripheral circuits, an internal voltageVARY (<VDD) for an array voltage of the memory cell array 50, and aninternal voltage VPP (>VDD) for an activation potential of the word lineWL are included. In each of the core chips CC0 to CC7, a power-ondetecting circuit 71 is also provided. When the supply of power isdetected, the power-on detecting circuit 71 resets various internalcircuits.

The peripheral circuits in the core chips CC0 to CC7 operates insynchronization with the internal clock signal ICLK that is suppliedform the interface chip IF through the TSV. The internal clock signalICLK supplied through the TSV is supplied to the various peripheralcircuits through the input buffer B2.

The above description is the basic circuit configuration of the corechips CC0 to CC7. In the core chips CC0 to CC7, the front end unit foran interface with the external device is not provided. Therefore thecore chip cannot operate as a single chip in principle. However, if thecore chip never operates as the single chip, an operation test of thecore chip in a wafer state may not be performed. This means that thesemiconductor memory device 10 cannot be tested, before the interfacechip and the plural core chips are fully assembled. In other words, theindividual core chips are tested when testing the semiconductor memorydevice 10. When unrecoverable defect exists in the core chips, theentire semiconductor memory device 10 is led to be unavailable. In thisembodiment, in the core chips CC0 to CC7, a portion of a pseudo frontend unit, for testing, that includes some test pads TP and a test frontend unit of a test command decoder 65 is provided, and an address signaland test data or a command signal can be input from the test pads TP. Itis noted that the test front end unit is provided for a simple test in awafer test, and does not have all of the front end functions in theinterface chip. For example, since an operation frequency of the corechips is lower than an operation frequency of the front end unit, thetest front end unit can be simply realized with a circuit that performsa test with a low frequency.

Kinds of the test pads TP are almost the same as those of the externalterminals provided in the interposer IP. Specifically, the test padsincludes a test pad TP1 to which a clock signal is input, a test pad TP2to which an address signal is input, a test pad TP3 to which a commandsignal is input, a test pad TP4 for input/output test data, a test padTP5 for input/output a data strobe signal, and a test pad TP6 for apower supply potential.

A common external command (not decoded) is input at testing. Therefore,the test command decoder 65 is also provided in each of the core chipsCC0 to CC7. Because serial test data is input and output at testing, atest input/output circuit 55 is also provided in each of the core chipsCC0 to CC7.

This is the entire configuration of the semiconductor memory device 10.Because in the semiconductor memory device 10, the 8 core chips of 1 Gbare laminated, the semiconductor memory device 10 has a memory capacityof 8 Gb in total. Because the chip selection signal /CS is input to oneterminal (chip selection terminal), the semiconductor memory device isrecognized as a single DRAM having the memory capacity of 8 Gb, in viewof the controller.

FIG. 5 is a diagram showing a circuit associated with selection of thecore chips CC0 to CC7.

As shown in FIG. 5, the layer address generating circuits 46 areprovided in the core chips CC0 to CC7, respectively, and arecascade-connected through the TSV2 of the type shown in FIG. 2B. Thelayer address generating circuit 46 includes a layer address register 46a, an increment circuit 46 b, and a transmission circuit 46 c.

The layer address register 46 a holds a layer address (chipidentification information) LID of 3 bits. When the power supply isdetected by the power-on detecting circuit 71 shown in FIG. 4, aregister value is initialized to a minimum value (0, 0, 0). In the corechip CC0 of the uppermost layer, the increment circuit 46 b incrementsan layer address LID (0, 0, 0) in the layer address register 46 a andthe incremented value (0, 0, 1) is transmitted to the core chip CC1 ofthe lower layer by the transmission circuit 46 c. A transmitted layeraddress LID (0, 0, 1) is set to the layer address register 46 a of thecore chip CC1.

Even in the core chip CC1, a value (0, 1, 0) that is obtained byincrementing the layer address LID (0, 0, 1) in the layer addressregister 46 a by the increment circuit 46 b is transmitted to the corechip CC2 of the lower layer by the transmission circuit 46 c.

Hereinafter, in the same way as the above case, the incremented layeraddresses LID are sequentially transmitted to the core chips of thelower layers. Finally, a maximum value (1, 1, 1) is set to the layeraddress register 46 a of the core chip CC7 of the lowermost layer.Thereby, each of the core chips CC0 to CC7 has a unique layer addressLID.

A defective chip signal DEF is supplied from the defective chipinformation holding circuit 33 of the interface chip IF to the layeraddress generating circuit 46 through the TSV3 of the type shown in FIG.2C. The defective chip signal DEF is a signal of 8 bits and the bits aresupplied to the corresponding core chips CC0 to CC7. The core chip wherethe corresponding bits of the defective chip signal DEF is activated isthe defective chip. In the core chip where the corresponding bits of thedefective chip signal DEF is activated, the transmission circuit 46 ctransmits, to the core chip of the lower layer, a non-incremented layeraddress LID, not an incremented layer address LID. In other words, theLID allocating of defective chip is skipped. That is, the layer addressLID that is allocated to each of the core chips CC0 to CC7 is not fixedand changes according to the defective chip signal DEF. The same layeraddress LID as the lower layer is allocated to the defective chip.However, since the control logic circuit 63 is prohibited from beingactivated in the defective chip, a read operation or a write operationis not securely performed, even though an address signal or a commandsignal is input from the interface chip IF.

The layer address LID is further supplied to the layer address comparingcircuit (chip information comparing circuit) 47 in each of the corechips CC0 to CC7. The layer address comparing circuit 47 compares thelayer address LID (chip identification information) supplied from thelayer address generating circuit 46 and a portion of the address signal(chip selection information SEL) supplied from the interface chip IFthrough the TSV. As the address signal is commonly supplied to the corechips CC0 to CC7 through the TSV1 of the type shown in FIG. 2A, the corechip where matching is detected as a comparison result by the layeraddress comparing circuit 47 is only one.

The address signal supplied form the interface chip IF includes a rowaddress and a column address, and the row address and the column addressare supplied to the core chips CC0 to CC7 in order of the row addressand the column address. Accordingly, when the all of chip selectioninformation SEL is included in the row address, the comparison operationis completed when the row address is input. Meanwhile, when a portion ofthe chip selection information SEL is included in the row address and aremaining portion of the chip selection information SEL is included inthe column address, the comparison operation is not completed when therow address is input and is completed when the column address is input.

A portion of the address signal that is used as the chip selectioninformation SEL depends on the I/O configuration. That is, the chipselection information SEL is not fixed and changes according to the I/Oconfiguration. In this case, the I/O configuration indicates theconfiguration of the number of bits of external unit data that issimultaneously input and output between the semiconductor memory deviceand the external device. In this embodiment, the 16-bit configuration(DQ0 to DQ15), the 8-bit configuration (DQ0 to DQ7), and the 4-bitconfiguration (DQ0 to DQ3) can be selected. The I/O configuration can beselected by fuse cutting or a bonding option.

FIG. 6 is a table illustrating allocation of an address according to theI/O configuration.

As shown in FIG. 6, when the 16-bit configuration (16DQ) is selected,bits A0 to A15 of an address signal are used as row addresses X0 to X15and the bits A0 to A9 are used as column addresses Y0 to Y9. Among them,the row addresses X13 to X15 are used as the chip selection informationSEL. Accordingly, when the 16-bit configuration (16DQ) is selected, thechip selection information SEL is fixed at inputting the row address.

When the 8-bit configuration (8DQ) is selected, the bits A0 to A15 ofthe address signal are used as the row addresses X0 to X15 and the bitsA0 to A9 and A11 are used as the column addresses Y0 to Y9 and Y11.Among them, the row addresses X14 and X15 and the column address Y11 areused as the chip selection information SEL. When the 4-bit configuration(4DQ) is selected, the bits A0 to A15 of the address signal are used asthe row addresses X0 to X15 and the bits A0 to A9, A11, and A13 are usedas the column addresses Y0 to Y9, Y11, and Y13. Among them, the rowaddresses X14 and X15 and the column address Y13 are used as the chipselection information SEL. Accordingly, when the 8-bit configuration(8DQ) or the 4-bit configuration (4DQ), the chip selection informationSEL is not fixed before both the row address and the column address areinput.

Referring back to FIG. 5, the layer address control circuit 45 uses adesignation signal SET to designate a portion of the address signal usedas the chip selection information SEL, according to the selected I/Oconfiguration. The designation signal SET is commonly supplied to thelayer address comparing circuits 47 of the core chips CC0 to CC7 throughthe TSVs. The layer address comparing circuit compares the layer addressLID supplied from the layer address generating circuit 46 and the chipselection information SEL supplied from the interface chip IF andactivates a matching signal HIT, when the layer address LID and the chipselection information SEL are matched with each other. The matchingsignal HIT is supplied to the control logic circuit 63 in thecorresponding core chip. The control logic circuit 63 is activated bythe matching signal HIT and validates internal commands ICMD that aresupplied from the interface chip IF through the TSV. Among the validatedinternal commands, an internal row command IRCMD is supplied to the rowcontrol circuit 61 shown in FIG. 1 and an internal column command ICCMDis supplied to the column control circuit 62 shown in FIG. 1. In casethe matching signal HIT is not activated, the control logic circuit 63invalidates the internal commands ICMD. Accordingly, the internalcommands ICMD that are commonly supplied to the core chips CC0 to CC7are validated in any one of the core chips CC0 to CC7.

FIG. 7 shows another example of a circuit associated with selection ofthe core chips CC0 to CC7, which specifically shows the configuration ofthe layer address comparing circuit 47.

As shown in FIG. 7, the layer address comparing circuit 47 includes alayer address selecting circuit 47 a, a row address comparing circuit 47x, and a column address comparing circuit 47 y. The layer addressselecting circuit 47 a receives the designation signal SET and selects aportion of an address signal ADD to be supplied to the row addresscomparing circuit 47 x and/or the column address comparing circuit 47 y.As described above, the designation signal SET is supplied from thelayer address control circuit 45, on the basis of the I/O configuration.

The row address that is selected by the layer address selecting circuit47 a is supplied to the row address comparing circuit 47 x together withthe corresponding bits of the layer address LID. The row addresscomparing circuit 47 x compares the row address and the correspondingbits and activates a matching signal HITX, when the bits of the rowaddress and the corresponding bits are perfectly matched with eachother. Likewise, the column address that is selected by the layeraddress selecting circuit 47 a is supplied to the column addresscomparing circuit 47 y together with the corresponding bits of the layeraddress LID. The column address comparing circuit 47 y compares thecolumn address and the corresponding bits and activates a matchingsignal HITY, when the bits of the column address and the correspondingbits are perfectly matched with each other. The matching signals HITXand HITY are supplied to the control logic circuit 63.

FIG. 8 is a circuit diagram of the layer address comparing circuit 47.

As shown in FIG. 8, the bits A11 and A13 to A15 of the address signaland the bits LID0 to LID2 of the layer address LID are supplied to thelayer address selecting circuit 47 a, and the path for outputting thesesignals are switched by the designation signal SET.

Specifically, when the designation signal SET shows the 16-bitconfiguration (16DQ), the bits A13 to A15 of the address signal areoutput as output signals AX0 to AX2, respectively, and the bits LID0 toLID2 of the layer address LID are output as output signals LIDX0 toLIDX2, respectively. When the designation signal SET shows the 8-bitconfiguration (8DQ), the bits A14, A15, and A11 of the address signalare output as the output signals AX0, AX1, and AY0, respectively, andthe bits LID1 to LID2 of the layer address LID are output as the outputsignals LIDX0, LIDX1, and LIDY0, respectively. When the designationsignal SET shows the 4-bit configuration (4DQ), the bits A14, A15, andA13 of the address signal are output as the output signals AX0, AX1, andAY0, respectively, and the bits LID0 to LID2 of the layer address LIDare output as the output signals LIDX0, LIDX1, and LIDY0, respectively.

Among the output signals that are selected in the above way, signals ofa row address, that is, the signals AX0 to AX2 and LIDX0 to LIDX2 aresupplied to the row address comparing circuit 47 x. The row addresscomparing circuit 47 x has ENOR gate circuits G0 to G2 that compare thecorresponding bits of the output signals and an AND gate circuit G3 thatreceives output signals COMPX0 to COMPX2 of the ENOR gate circuits G0 toG2, and an output of the AND gate circuit G3 is used as the matchingsignal HITX.

Meanwhile, among the output signals from the layer address selectingcircuit 47 a, the signals of the column address, that is, the signalsAY0 and LIDY0 are supplied to the column address comparing circuit 47 ycomposed of an ENOR gate circuit G4. An output signal COMPY0 of the ENORgate circuit G4 is used as the matching signal HITY.

When the designation signal SET shows the 16-bit configuration (16DQ),the output signals AY0 and LIDY0 of the layer address selecting circuit47 a are fixed at the same logical level. Thereby, the matching signalHITY is maintained in an activated state. When the designation signalSET shows the 8-bit configuration (8DQ) or the 4-bit configuration(4DQ), the output signals AX2 and LIDX2 of the layer address selectingcircuit 47 a are fixed at the same logical level. Thereby, the outputsignal COMPX2 is maintained in an activated state.

FIG. 9 is a block diagram showing the circuit configuration of thecontrol logic circuit 63.

As shown in FIG. 9, the control logic circuit 63 includes a row commandcontrol circuit 63 x and a column command control circuit 63 y. The rowcommand control circuit 63 x receives a row command RCMD included in theinternal commands ICMD and selects whether the row command RCMD issupplied as an internal row command IRCMD to the row control circuit 61.The selection depends on the matching signal HITX and the defective chipsignal DEF. Specifically, the row command RCMD is output as the internalrow command IRCMD, only when the matching signal HITX is activated andthe defective chip signal DEF is inactivated (the corresponding chip isnot the defective chip). In the other cases, since the row command RCMDis interrupted in the row command control circuit 63 x, the validinternal row command IRCMD is not supplied to the row control circuit61.

The internal row command IRCMD is also supplied to a latch circuit 63 a.In the latch circuit 63 a that is an SR-type latch circuit, the internalrow command IRCMD is input to a set input terminal S. A latch signal LTis output from an output terminal Q of the latch circuit 63 a and issupplied to one input terminal of the AND gate circuit G5. A columncommand CCMD that is included in the internal command ICMD is input tothe other input terminal of the AND gate circuit G5. An output of theAND gate circuit G5 is supplied to the column command control circuit 63y.

The column command control circuit 63 y receives an output of the ANDgate circuit G5 and selects whether the output is supplied to the columncontrol circuit 62 as the internal column command ICCMD. This selectiondepends on the matching signal HITY and the defective chip signal DEF.Specifically, the column command CCMD is output as the internal columncommand ICCMD, only when the matching signal HITY is activated and thedefective chip signal DEF is inactivated (the corresponding chip is notthe defective chip). In the other cases, since an output of the AND gatecircuit G5 is interrupted in the column command control circuit 63 y,the valid internal column command ICCMD is not supplied to the columncontrol circuit 62.

Of course, even in the case where the matching signal HITY is activatedand the defective chip signal DEF is inactivated (the corresponding chipis not the defective chip), when the latch circuit 63 a is not set (isreset), the column command CCMD is interrupted in the AND gate circuitG5. Therefore, the valid internal column command ICCMD is not suppliedto the column control circuit 62.

By this configuration, in only one core chip that is selected by thechip selection information SEL among the core chips CC0 to CC7, thevalid internal row command IRCMD and the internal column command ICCMDare supplied to the row control circuit 61 and the column controlcircuit 62, respectively. Accordingly, a selective access for the corechips CC0 to CC7 is enabled.

In the core chip where the latch circuit 63 a is reset, that is, thecore chip where the internal row command IRCMD is not activated, sincethe column command CCMD is interrupted by the AND gate circuit G5, thecore chips that are not selected do not cause an erroneous operation.

The row command control circuit 63 x and the column command controlcircuit 63 y maintain the internal row command IRCMD and the internalcolumn command ICCMD in an inactivated state, when the defective chipsignal DEF is activated (when the corresponding chip is the defectivechip). Therefore, a normal access is prevented from being disturbed dueto an unexpected operation caused by the defective chip. Further,consumption power of the defective chip is reduced.

The control logic circuit 63 receives the valid commands with respect toall of the core chips CC0 to CC7 among the internal commands ICMD andsupplies the valid commands to a circuit of a rear stage, except for thecase where the defective chip signal DEF is activated (correspondingchip is the defective chip). As these commands, a refresh command REF, amode register set command MRS, and a precharge command PRE areexemplified, and are output as an internal refresh command IREF, aninternal mode register set command IMRS, and an internal prechargecommand IPRE, respectively. These commands are interrupted by thecontrol circuit 63 b or the control circuit 63 c, when the defectivechip signal DEF is activated (the corresponding chip is the defectivechip).

As shown in FIG. 9, the internal precharge command IPRE is also input toa reset input terminal R of the latch circuit 63 a. The internalprecharge command IPRE is issued when an access ends. When the internalprecharge command IPRE is issued, a state of the latch circuit 63 a isreturned to a reset state and it is prepared to receive a next access.

FIG. 10 is a timing chart illustrating an operation of the control logiccircuit 63, which shows an operation when the core chip CC0 is selectedin the case where the I/O configuration is the 8-bit configuration (or4-bit configuration).

First, if an active command ACT is issued in synchronization with anexternal clock signal CK, the row command RCMD is activated. The rowaddress for selecting the core chip CC0 is input at the same time as aninput of the active command ACT. However, as described using FIG. 6,when the 8-bit configuration (or 4-bit configuration) is selected, thechip selection information SEL is not determined by only the rowaddress. For this reason, in this example, two matching signals HITX[0]and HITX[4] are activated in response to the active command ACT. Theother matching signals HITX[1 to 3 and 5 to 7] are inactivated. In thiscase, [i](i=0 to 7) that is added to a tail of a signal name means asignal in the core chip CCi.

When the matching signals HITX[0, 4] are activated, the internal rowcommand IRCMD is activated in the core chips CC0 and CC4. Thereby, thelatch circuit 63 a is set and the latch signals LT[0, 4] are activated.The other latch signals LT[1 to 3 and 5 to 7] are inactivated.

Next, when a read command READ that is one of column command is issuedin synchronization with the external clock signal CK, the column commandCCMD is activated. As the column address for selecting the core chip CC0is input at the same time as an input of the read command READ, the fourmatching signals HITY including the matching signal HITY[0] areactivated by a bit Y11 (Y13 in the case of 4DQ) of the column address.At this time, the matching signal HITY[4] is not activated.

The activated latch signals are only the latch signals LT[0, 4]. As aresult, the activated internal column command ICCMD becomes only theinternal column command ICCMD[0] in the core chip CC0 and the internalcolumn commands ICCMD[1 to 7] in the other core chips CC1 to CC7 aremaintained in an inactivated state.

As when the 8-bit configuration (or 4-bit configuration) is selected,even in case the chip selection information SEL is determined by boththe row address and the column address, the internal column commandICCMD is activated with respect to the core chip to be selected and isnot activated with respect to the other core chips. Thereby, the corechips that are not selected not perform an unexpected operation, andonly the selected core chip normally operates.

As described above, since the semiconductor memory device 10 accordingto this embodiment uses part of the address signal for specifying thememory cell as the chip selection information SEL, a special signal forselecting a chip is not needed. That is, the controller recognizes thesemiconductor memory device as a single DRAM having a memory capacity of8 GB, and the interface is the same as the interface of the DRAMaccording to the related art. Therefore, compatibility with the DRAMaccording to the related art can be secured.

Because a bit of the address signal that is used as the chip selectioninformation SEL is selected according to the I/O configuration,complicated control such as changing the page configuration according toan I/O number is not needed. That is, as shown in FIG. 6, when the16-bit configuration (=16DQ) is selected, the bits X0 to X12 are used asthe row address in the core chips, and all of the remaining bits X13 toX15 can be allocated to the chip selection information SEL. When the8-bit configuration (=8DQ) or the 4-bit configuration (=4DQ) isselected, the bit X13 is also used as the row address in the core chip.For this reason, if the chip selection information SEL is allocated inthe same way as that of the 16-bit configuration, a process of switchinga page size from 1 KB to 2 KB is needed. Meanwhile, according to thesemiconductor memory device 10 in this embodiment, the switching is notneeded and the circuit configuration can be simplified.

In the semiconductor memory device 10 according to this embodiment,because the defective chip is skipped in the allocation of the layeraddress LID, the controller recognizes that there is no defective chip.Therefore, even when the defective chip is discovered after an assembly,only the valid partial core chips can be operated without requesting thecontroller to perform the special control.

When the defective chip is discovered after the assembly, it ispreferable to set a valid core chip number as power-of-two byinvalidating the normal chips according to necessity. Specifically, whenthe defective chip number is 1 to 4, the valid core chip number may beset as 4, when the defective chip number is 5 and 6, the valid core chipnumber may be set as 2, and when the defective chip number is 7, thevalid core chip number may be set as 1. According to this configuration,since an address space becomes power-of-two, control of the controlleris facilitated.

FIGS. 11A and 11B are tables illustrating allocation of an addressaccording to the I/O configuration, when the defective chip exists. FIG.11A shows the case where the valid core chip number is 4 (=4 GB) andFIG. 11B shows the case where the valid core chip number is 2 (2 GB).

As shown in FIG. 11A, in the case of the 4 GB configuration using thefour core chips, the row address X15 in the 16-bit configuration (16DQ),the column address Y11 in the 8-bit configuration (8DQ), and the columnaddress Y13 in the 4-bit configuration (4DQ) are not used, as comparedwith the address configuration shown in FIG. 6. In regards to the chipselection information SEL, the same bits as the example shown in FIG. 6are used, except that the bit configuration becomes the 2-bitconfiguration and the most significant bit SEL2 is not used.

As shown in FIG. 11B, in the case of the 2 GB configuration using thetwo core chips, the row addresses X14 and X15 in the 16-bitconfiguration (16DQ), the row address X15 and the column address Y11 inthe 8-bit configuration (8DQ), and the row address X15 and the columnaddress Y13 in the 4-bit configuration (4DQ) are not used, as comparedwith the address configuration shown in FIG. 6. In regards to the chipselection information SEL, the same bits as the example shown in FIG. 6are used, except that the bit configuration becomes the 1-bitconfiguration and the upper 2 bits SEL2 and SEL1 are not used.

As such, even when some core chips are not used, the circuitconfiguration of the layer address comparing circuit 47 does not need tobe changed.

FIG. 12 is a diagram showing the configuration of a data processingsystem using the semiconductor memory device 10 according to thisembodiment.

The data processing system shown in FIG. 12 includes a memory module 100and a controller 200 connected to the memory module 100. In the memorymodule 100, the plural semiconductor memory devices 10 are mounted on amodule substrate 101. A register 102 that receives an address signal ora command signal supplied from the controller 200 is mounted on themodule substrate 101, and the address signal or the command signal issupplied to each semiconductor memory device 10 through the register102.

In the data processing system that has the above configuration, thecontroller 200 may supply only various signals, such as the addresssignals or the command signals, which are needed for an access of acommon DRAM, and does not need to supply a special signal, such as achip selection address, which is not used in the common DRAM.

It is apparent that the present invention is not limited to the aboveembodiments, but may be modified and changed without departing from thescope and spirit of the invention.

For example, in the above described embodiment, the DDR3-type SDRAM isused as the core chip, but the present invention is not limited thereto.Accordingly, the core chip may be a DRAM other than the DDR3-type andmay be a semiconductor memory (SRAM, PRAM, MRAM or flash memory) otherthan the DRAM. All of the core chips do not need to be laminated and allor part of the core chips may be two-dimensionally disposed. The numberof core chips is not restricted to 8.

1. A semiconductor device comprising: a plurality of core chips thatinclude a memory cell array having a plurality of memory cells,respectively being assigned a plurality of chip identificationinformation, respectively, and the plurality of chip identificationinformation being different from each other; and an interface chip thatcontrols the plurality of core chips by using chip selection informationthat is compared with the chip identification information, wherein theinterface chip receives address information from outside to specify atleast one of the memory cells included in the memory cell array andcommonly supplies the plurality of core chips with a part of the addressinformation as the chip selection information.
 2. The semiconductordevice as claimed in claim 1, wherein the interface chip commonlysupplies command information to the plurality of core chips, each of thecore chips includes a chip information comparing circuit that receivesthe chip selection information and a control logic circuit that receivesthe command information, and the chip information comparing circuitactivates the control logic circuit when the chip identificationinformation and the chip selection information are matched with eachother.
 3. The semiconductor device as claimed in claim 2, wherein theaddress information includes a row address and a column address, thecommand information includes a row command and a column command, atleast a part of the chip selection information is included in the rowaddress, the interface chip commonly supplies the row address and therow command to the plurality of core chips and then commonly suppliesthe column address and the column command to the plurality of corechips, and the control logic circuit includes a row command controlcircuit that generates an internal row command based on the supplied rowcommand, when the chip information comparing circuit detects that atleast a part of the chip selection information included in the rowaddress and at least a part of the chip identification information arematched with each other.
 4. The semiconductor device as claimed in claim3, wherein the control logic circuit further includes: a latch circuitthat changes its state from a reset state to a set state in response toactivation of the internal row command; and a column command controlcircuit that prohibits activation of an internal column commandgenerated based on the column command when the latch circuit is in thereset state.
 5. The semiconductor device as claimed in claim 4, whereinanother part of the chip selection information is included in the columnaddress, and the column command control circuit generates the internalcolumn command, when the latch circuit is in the set state and the chipinformation comparing circuit detects that a part of the chip selectioninformation included in the column address and another part of the chipidentification information are matched with each other.
 6. Thesemiconductor device as claimed in claim 4, wherein the latch circuit isreset in response to the command information indicating an access ends.7. The semiconductor device as claimed in 2, wherein the control logiccircuit is activated, regardless of the chip selection information, whenvalid command information with respect to all of the plurality of corechips among the command information is supplied.
 8. The semiconductordevice as claimed in claim 2, wherein a number of bits of external unitdata that is simultaneously input and output between the outside and theinterface chip is variable, and the interface chip changes the chipselection information according to the number of bits of the externalunit data.
 9. The semiconductor device as claimed in claim 8, wherein,the chip selection information is configured by a part of the rowaddress when the number of bits of the external unit data is a firstnumber, and the chip selection information is configured by a part ofthe row address and a part of the column address when the number of bitsof the external unit data is a second number.
 10. The semiconductordevice as claimed in claim 8, wherein the chip information comparingcircuit includes an address selecting circuit that extracts a portion ofthe address information as the chip selection information according tothe number of bits of the external unit data.
 11. The semiconductordevice as claimed in claim 1, wherein the interface chip includes a chipinformation storing circuit that specifies one or more invalid chipsamong the plurality of core chips.
 12. The semiconductor device asclaimed in claim 1, wherein the plurality of core chips are laminated.13. The semiconductor device as claimed in claim 12, each of the corechips having a semiconductor substrate and a plurality of throughsilicon vias that penetrates the semiconductor substrate, and each ofthe through silicon vias is electrically connected to an associated oneof the through silicon vias provided in adjacent core chip.
 14. Thesemiconductor device as claimed in claim 12, wherein the plurality ofcore chips and the interface chip are laminated.
 15. A semiconductordevice mounted on a substrate, comprising: an interface chip mounted onthe substrate, receiving a plurality of address signals from thesubstrate, generating chip select information in response to at leastone of the address signals; a first core chip mounted on the interfacechip, holding first chip identification information, receiving the chipselect information, comparing the first chip identification informationwith the chip select information, and outputting a first activate signalwhen the first chip identification information is coincident with thechip select information; and a second core chip mounted on the firstcore chip, holding second chip identification information which isdifferent from the first chip identification information, receiving thechip select information in common with the first core chip, comparingthe second chip identification information with the chip selectinformation, and outputting a second activate signal when the secondchip identification information is coincident with the chip selectinformation.
 16. The semiconductor device as claimed in claim 15,wherein the first identification information includes a number of firstbits and the second identification information includes a number ofsecond bits and either the first bits or the second bits is generated byincrementing the other of the first bits and the second bits by one. 17.The semiconductor device as claimed in claim 15, wherein the interfacechip further receives command signals from the substrate, generatingcommand information in response to the command signals, the first corechip receiving the command information, the first core chip beingoperated in response to the command information when the first core chipoutputs the first activate signal, and being not operated in response tothe command information when the first core chip does not output thefirst activate signal.
 18. The semiconductor device as claimed in claim15, wherein the interface chip further receives command signals from thesubstrate, generating command information in response to the commandsignals, the second core chip receiving the command information, thesecond core chip being operated in response to the command informationwhen the second core chip outputs the second activate signal, and beingnot operated in response to the command information when the second corechip does not output the second activate signal.
 19. The semiconductordevice as claimed in claim 17, wherein the second core chip receives thecommand information, the second core chip being operated in response tothe command information when the second core chip outputs the secondactivate signal, and being not operated in response to the commandinformation when the second core chip does not output the secondactivate signal.
 20. The semiconductor device as claimed in claim 15,wherein the first core chip includes a plurality of memory cell arrayseach including a plurality of memory cells, the address signals otherthan the at least one of the address signals being supplied to the firstcore chip to select an associated one of the memory cells in the memorycell arrays.
 21. The semiconductor device as claimed in claim 15,wherein the second core chip includes a plurality of memory cell arrayseach including a plurality of memory cells, the address signals otherthan the at least one of the address signals being supplied to thesecond core chip to select an associated one of the memory cells in thememory cell arrays.
 22. The semiconductor device as claimed in claim 17,wherein the command information is row command information, theinterface chip further receiving additional command signals to generatecolumn command information, the first core chip includes a first latchcircuit, the first core chip further receiving the column commandinformation, the first core chip being operated in response to thecolumn command information when the first latch circuit latches thefirst activate signal, and the first core chip being not operated inresponse to the column command information when the first latch circuitdoes not latch the first activate signal.
 23. The semiconductor deviceas claimed in claim 17, wherein the command information is row commandinformation, the interface chip further receiving additional commandsignals to generate column command information, the second core chipincludes a second latch circuit, the second core chip further receivingthe column command information, the second core chip being operated inresponse to the column command information when the second latch circuitlatches the second activate signal, and the second core chip being notoperated in response to the column command information when the secondlatch circuit does not latch the second activate signal.